| Issue | Title | |
| Thermal Conductivity 33/Thermal Expansion 21 | Challenges of Transient-Plane-Source Measurements at Temperatures Between 500K and 1000K | Abstract |
| PITT GOETZE, SIMON HUMMEL, RHENA WULF, TOBIAS FIEBACK, ULRICH GROSS | ||
| Thermal Conductivity 33/Thermal Expansion 21 | Characterization of Thermal Conductivity in Fe-ions Irradiated Single Crystal Silicon | Abstract |
| YUEFANG DONG, ZILONG HUA, HENG BAN | ||
| Thermal Conductivity 33/Thermal Expansion 21 | Directional Selective Thermal Diffusivity Jump by Temperature in High Purity Graphene Paper | Abstract |
| YANGSU XIE, MENG HAN, XINWEI WANG | ||
| Thermal Conductivity 33/Thermal Expansion 21 | Efficiency Improvement in Electronics Cooling | Abstract |
| AZIZE AKCAYOGLU | ||
| Thermal Conductivity 33/Thermal Expansion 21 | Exact Solution for the Thermal Capacitance (Slug) Calorimeter Method | Abstract |
| AKHAN TLEOUBAEV | ||
| Thermal Conductivity 33/Thermal Expansion 21 | Experimental Methods to Obtain Thermal Conductivity and Thermal Diffusivity of Liquid Metals and Alloys: A Review | Abstract |
| PETER PICHLER, GERNOT POTTLACHER | ||
| Thermal Conductivity 33/Thermal Expansion 21 | Granular Jamming and Thermal Modeling in Faceted Particle Packings | Abstract |
| RAJATH KANTHARAJ, ISHAN SRIVASTAVA, AMY M. MARCONNET, TIMOTHY S. FISHER | ||
| Thermal Conductivity 33/Thermal Expansion 21 | Improved Transient Method Measures Thermal Conductivity of Insulating Materials | Abstract |
| PAOLO CASTIGLIONE, GAYLON CAMPBELL | ||
| Thermal Conductivity 33/Thermal Expansion 21 | In Memory | Details |
| Thermal Conductivity 33/Thermal Expansion 21 | Laser Flash Measurements on Thermal Conductivity of Bio-Fiber (Kenaf) Reinforced Composites | Abstract |
| LEVI GARDNER, TROY MUNRO, EZEKIEL VILLARREAL, KURT HARRIS, THOMAS FRONK, HENG BAN | ||
| Thermal Conductivity 33/Thermal Expansion 21 | Long-Term Thermal Resistance of Thin Cellular Plastic Insulations | Abstract |
| DAVID W. YARBROUGH, MICHEL P. DROUIN | ||
| Thermal Conductivity 33/Thermal Expansion 21 | Measured and Predicted Thermal Conductivities for YSZ Layers: Application of Different Models | Abstract |
| KSENIA ILLKOVA, RADEK MUSALEK, JAN MEDRICKY | ||
| Thermal Conductivity 33/Thermal Expansion 21 | Measurement of Thermal Diffusivity at High Temperature by Laser Flash Method | Abstract |
| ZHUORUI SONG, TYSON WATKINS, HENG BAN | ||
| Thermal Conductivity 33/Thermal Expansion 21 | Preface | Details |
| Thermal Conductivity 33/Thermal Expansion 21 | Round Robin Test of Thermal Conductivity for a Loose Fill Thermal Insulation Product in Europe | Abstract |
| SUSANNE DEHN, ERIK RASMUSSEN, CRISPIN ALLEN | ||
| Thermal Conductivity 33/Thermal Expansion 21 | Simulated Thermal Characterization of Materials Via a Blu-ray Based Scanning Fluorescence Microscope | Abstract |
| SAMUEL HAYDEN, RYKER HADDOCK, TROY MUNRO | ||
| Thermal Conductivity 33/Thermal Expansion 21 | Specific Heat Measurements of Large-Size Samples with the Hot Disk Thermal Constants Analyser | Abstract |
| DALE HUME, ANDREY SIZOV, BESIRA M. MIHIRETIE, DANIEL CEDERKRANTZ, SILAS E. GUSTAFSSON, MATTIAS K. GUSTAVSSON | ||
| Thermal Conductivity 33/Thermal Expansion 21 | The Study of Crystalline Orientation and Interface Thermal Conductance of Mechanical Exfoliated Black Phosphorus with Raman-based Techniques | Abstract |
| TIANYU WANG, XINWEI WANG | ||
| Thermal Conductivity 33/Thermal Expansion 21 | Thermal Conductivity Measurement of Ion-irradiated Materials | Abstract |
| ZILONG HUA, YUEFANG DONG, HENG BAN | ||
| Thermal Conductivity 33/Thermal Expansion 21 | Thermal Conductivity Measurements of Calcium Oxalate Monohydrate as Thermochemical Heat Storage Material | Abstract |
| DANIEL LAGER, CHRISTIAN KNOLL, DANNY MULLER, WOLFGANG HOHENAUER, PETER WEINBERGER, ANDREAS WERNER | ||
| Thermal Conductivity 33/Thermal Expansion 21 | Thermal Conductivity of b-tungsten Nanofilms and Interface Thermal Resistance Between b-tungsten Sublayers | Abstract |
| MENG HAN, XINWEI WANG | ||
| Thermal Conductivity 33/Thermal Expansion 21 | Thermal Transport by Hot Carrier in Sub-10 nm MoS2 Atomic Layer | Abstract |
| PENGYU YUAN, JING LIU, RIDONG WANG, XINWEI WANG | ||
| Thermal Conductivity 33/Thermal Expansion 21 | Validation of a 3D Pore Scale Prediction Model for the Thermal Conductivity of Porous Building Materials | Abstract |
| WOUTER VAN DE WALLE, STEVEN CLAES, HANS JANSSEN | ||
| Thermal Conductivity 33/Thermal Expansion 21 | Walls Thermal Resistance Measurement with an Energy Room Method: Uncertainty and Analysis of Different Approaches | Abstract |
| ALAIN KOENEN, DAMIEN MARQUIS | ||
| 1 - 24 of 24 Items | ||