Thermal Conductivity 33/Thermal Expansion 21
Open Access
Subscription or Fee Access
Proceedings of the 33rd International Thermal Conductivity Conference and the 21st International Thermal Expansion Symposium
Edited by: Heng Ban, Ph.D
Table of Contents
Preface
|
|
In Memory
|
|
CHAPTER 1 — MEASUREMENT METHODS
PETER PICHLER, GERNOT POTTLACHER
|
|
PITT GOETZE, SIMON HUMMEL, RHENA WULF, TOBIAS FIEBACK, ULRICH GROSS
|
|
DALE HUME, ANDREY SIZOV, BESIRA M. MIHIRETIE, DANIEL CEDERKRANTZ, SILAS E. GUSTAFSSON, MATTIAS K. GUSTAVSSON
|
|
ZHUORUI SONG, TYSON WATKINS, HENG BAN
|
|
PAOLO CASTIGLIONE, GAYLON CAMPBELL
|
|
CHAPTER 2 — MATERIAL PROPERTIES
LEVI GARDNER, TROY MUNRO, EZEKIEL VILLARREAL, KURT HARRIS, THOMAS FRONK, HENG BAN
|
|
SUSANNE DEHN, ERIK RASMUSSEN, CRISPIN ALLEN
|
|
KSENIA ILLKOVA, RADEK MUSALEK, JAN MEDRICKY
|
|
DANIEL LAGER, CHRISTIAN KNOLL, DANNY MULLER, WOLFGANG HOHENAUER, PETER WEINBERGER, ANDREAS WERNER
|
|
DAVID W. YARBROUGH, MICHEL P. DROUIN
|
|
CHAPTER 3 — ANALYSIS AND MODELING
RAJATH KANTHARAJ, ISHAN SRIVASTAVA, AMY M. MARCONNET, TIMOTHY S. FISHER
|
|
ALAIN KOENEN, DAMIEN MARQUIS
|
|
WOUTER VAN DE WALLE, STEVEN CLAES, HANS JANSSEN
|
|
AKHAN TLEOUBAEV
|
|
Simulated Thermal Characterization of Materials Via a Blu-ray Based Scanning Fluorescence Microscope
SAMUEL HAYDEN, RYKER HADDOCK, TROY MUNRO
|
|
CHAPTER 4 — ADVANCED MATERIALS AND APPLICATIONS
YANGSU XIE, MENG HAN, XINWEI WANG
|
|
TIANYU WANG, XINWEI WANG
|
|
YUEFANG DONG, ZILONG HUA, HENG BAN
|
|
MENG HAN, XINWEI WANG
|
|
PENGYU YUAN, JING LIU, RIDONG WANG, XINWEI WANG
|
|
ZILONG HUA, YUEFANG DONG, HENG BAN
|
|
AZIZE AKCAYOGLU
|
|