Thermal Conductivity 33/Thermal Expansion 21


Thermal Conductivity 33/Thermal Expansion 21

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Proceedings of the 33rd International Thermal Conductivity Conference and the 21st International Thermal Expansion Symposium

Edited by: Heng Ban, Ph.D

Table of Contents

Preface
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In Memory
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CHAPTER 1 — MEASUREMENT METHODS

PETER PICHLER, GERNOT POTTLACHER
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PITT GOETZE, SIMON HUMMEL, RHENA WULF, TOBIAS FIEBACK, ULRICH GROSS
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DALE HUME, ANDREY SIZOV, BESIRA M. MIHIRETIE, DANIEL CEDERKRANTZ, SILAS E. GUSTAFSSON, MATTIAS K. GUSTAVSSON
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ZHUORUI SONG, TYSON WATKINS, HENG BAN
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PAOLO CASTIGLIONE, GAYLON CAMPBELL
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CHAPTER 2 — MATERIAL PROPERTIES

LEVI GARDNER, TROY MUNRO, EZEKIEL VILLARREAL, KURT HARRIS, THOMAS FRONK, HENG BAN
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SUSANNE DEHN, ERIK RASMUSSEN, CRISPIN ALLEN
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KSENIA ILLKOVA, RADEK MUSALEK, JAN MEDRICKY
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DANIEL LAGER, CHRISTIAN KNOLL, DANNY MULLER, WOLFGANG HOHENAUER, PETER WEINBERGER, ANDREAS WERNER
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DAVID W. YARBROUGH, MICHEL P. DROUIN
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CHAPTER 3 — ANALYSIS AND MODELING

RAJATH KANTHARAJ, ISHAN SRIVASTAVA, AMY M. MARCONNET, TIMOTHY S. FISHER
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ALAIN KOENEN, DAMIEN MARQUIS
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WOUTER VAN DE WALLE, STEVEN CLAES, HANS JANSSEN
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AKHAN TLEOUBAEV
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SAMUEL HAYDEN, RYKER HADDOCK, TROY MUNRO
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CHAPTER 4 — ADVANCED MATERIALS AND APPLICATIONS

YANGSU XIE, MENG HAN, XINWEI WANG
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TIANYU WANG, XINWEI WANG
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YUEFANG DONG, ZILONG HUA, HENG BAN
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MENG HAN, XINWEI WANG
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PENGYU YUAN, JING LIU, RIDONG WANG, XINWEI WANG
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ZILONG HUA, YUEFANG DONG, HENG BAN
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AZIZE AKCAYOGLU
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