International Conference on Materials, Manufacturing and Mechanical Engineering (MMME 2016)


Cover Page
  • International Conference on Materials, Manufacturing and Mechanical Engineering (MMME 2016)
  • ISBN: 978-1-60595-413-4
  • ISSN: 2572-889X

The aim objective of the 2016 International Conference on Materials, Manufacturing and Mechanical Engineering (MMME2016) is to provide a platform for researchers, engineers, academicians as well as industrial professionals from all over the world to present their research results and development activities in Materials, Manufacturing and Mechanical Engineering. 2016 International Conference on Materials, Manufacturing and Mechanical Engineering (MMME2016) will be held in Beijing China during December 30-31, 2016.

As a standard, DEStech will submit the technical science conference proceedings to be indexed in EI (Citation and Compendex). DEStech will submit the technical science conference proceedings to EI, Clarivate Analytics (formerly Thomson Reuters Web of Science) and CNKI Scholar for worldwide online citation within one month after the Proceedings is completed. Please note that DEStech does not submit Proceedings of Social Science to EI since they will not be accepted for EI Compendex. However, DEStech will submit proceedings of Social Science to Thomson Reuters Conference Proceedings Citation Index-Social Science & Humanities (CPCI-SSH). We also caution our editors that Proceedings containing plagiarized material and Proceedings advertised that they will definitely be accepted by EI will be rejected by EI.

2016 International Conference on Materials, Manufacturing and Mechanical Engineering

DEStech Publications, Inc.
439 North Duke Street Lancaster, Pennsylvania 17602 U.S.A.

Copyright © 2016 by DEStech Publications, Inc.

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Main entry under title:
2016 International Conference on Materials, Manufacturing and Mechanical Engineering (MMME 2016)

ISBN: 978-1-60595-413-4

Permission for publication outside of this Conference Proceeding must be given by the Publisher.