DEStech Transactions on Engineering and Technology Research


3rd International Symposium on Mechatronics and Industrial Informatics (ISMII 2017)


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  • 3rd International Symposium on Mechatronics and Industrial Informatics
  • ISBN: 978-1-60595-501-8
  • ISSN: 2475-885X

The 2017 3rd International Symposium on Mechatronics and Industrial Informatics (ISMII 2017) has been held on October 27–29, 2017 in Haikou, China. ISMII 2017 is to bring together innovative academics and industrial experts in the field of mechatronics and industrial informatics to a common forum. The primary goal of the conference is to promote research and developmental activities in mechatronics and industrial informatics and another goal is to promote scientific information interchange between researchers, developers, engineers, students, and practitioners working all around the world. The conference will be held every year to make it an ideal platform for people to share views and experiences in mechatronics and industrial informatics and related areas.

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2017 3rd International Symposium on Mechatronics and Industrial Informatics
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Main entry under title: 
2017 3rd International Symposium on Mechatronics and Industrial Informatics (ISMII 2017)
ISBN: 978-1-60595-501-8
Permission for publication outside of this Conference Proceeding must be given by the Publisher.