

Thermal Interface Materials: From Details to the Design
Abstract
This paper describes characterization of thermal interface materials (TIMs) for thermal performance and mechanical behavior in order to provide guidance for selection of materials and design of electronic assemblies using them. The examples considered in this work are from a series of filled elastomeric pads. Testing included determination of filler content, measurement of density, heat capacity, thermal diffusivity, and stress-strain behavior. From these results, we were able to determine thermal resistance in a bonded configuration and the appropriate range of compression for each pad that would achieve low thermal resistance without excessive pressure on the electronic parts. We also show that the effective modulus of the pad in compression correlates with “shape factor,†i.e. the ratio of constrained surface area to unconstrained surface area.
DOI
10.12783/tc34-te22/36217
10.12783/tc34-te22/36217
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