

Analysis on a Thermal Fracture Problem in Packaging Structures
Abstract
In this paper, the interaction integral method combine with the finite element method (FEM) are introduced to study the thermal fracture behaviors of packaging structures. The modified interaction integral is provided for solving the fracture problems of packaging materials subject to thermal loading and the path-independence of the integral is still kept. Some numerical examples are checked to verify the present method. The temperature fields and the thermal stress fields are calculated and the thermal stress intensity factors (TSIFs) are extracted. The influences of the crack lengths and temperature fields on the TSIFs are also considered.
Keywords
packaging structure; interaction integral; thermal stress intensity factorsText