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Numerical Analysis of the Residual Stresses in Z-Pinned Composite Laminates during the Curing Process

S. LI, J.Q. ZHANG, Z.S. GUO, H.J. HU

Abstract


In this study the residual stresses in z-pinned composites induced during process are analyzed by FE model. The model is composed of resin-rich region, composite and pin. The chemical shrinkage and thermal expansion of the matrix during curing are considered in this model. The interface between resin-rich region and composite or pin is studied in detail. The higher stresses are located at the vicinity of the interface. The stresses decrease quickly with distance away from the interface.

Keywords


residual stress, cure, chemical shrinkage, thermal expansion, z-pinText

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