Nanoscale Cutting Simulation of Single Crystal Copper Based on Multiscale Method

Abstract

A multiscale simulation method based on quasicontinuum (QC) theory was adopted to study the nanometric cutting process of single crystal copper. The cutting mechanisms were analyzed in atomistic view. Dislocation of workpiece in cutting process was examined in detail. The generation and disappearance of dislocation cause the fluctuations of tangential and normal cutting forces during the nanometric cutting process of single crystal copper. In addition, the effects of cutting depth on cutting force had also been investigated. Typical rule for cutting force in nanoscale cutting of single crystal copper was obtained by using multiscale simulation method. By comparison with the results in molecular dynamics (MD) simulation, it is shown that multiscale simulation can increase the modeling size without increasing of time consumption and accurate results can be found in the simulation.