Mapping Process Model Results to Fracture Model Initial Conditions for Adhesive Bonding

Abstract

A systematic approach is proposed for mapping adhesive bonding process outcomes to initial conditions for progressive damage analysis (PDA). Herein, two mapping procedures are developed: 1) direct mapping for residual stresses, strains, and deformations obtained from a process model; and 2) functional mapping for quantities such as bondline thickness, degree of cure, and porosity that are assumed to have a functional relationship with fracture toughness but are not discretely modeled in the PDA. The spatial distribution of functionally mapped quantities may be determined by process modeling or inspection. The functional maps between the quantity of interest and fracture toughness may be obtained from independent lower-scale numerical simulations or empirical test campaigns. The proposed mapping procedure links the adhesive bonding process to the structural performance. Therefore, by accounting for the effects of bondline nonuniformities in structural analysis, analytical predictive accuracy can be improved, and off-nominal conditions can be evaluated. The mapping procedures are demonstrated and verified with example problems.