Development of Reversible Bonded Joints Using Nano-Ferromagnetic Particles

Abstract

In this study, an efficient, simple, inexpensive and reversible adhesive bonding technology was developed to improved life cycle and recycling solutions for vehicle applications. For the purpose of remotely heating and melting the adhesive by subjecting the modified adhesive to an external electromagnetic fields, varying concentrations of commercially available nano-ferromagnetic particles were embedded in thermoplastic hot-melt adhesives using extrusion mixing process to investigate the thermal behavior and interaction with the electromagnetic field for this novel material. Furthermore, advanced deformation and temperature profile measurement techniques were used to monitor the temperature profiles of the substrates and nano-ferromagnetic particles modified adhesive film while subjected to the electromagnetic fields using infrared (IR) thermal camera and Fiber Bragg-grating (FBG) sensors. Results indicate that depending on the amount of nano-ferromagnetic particles and electromagnetic field exposure time, rapid temperature rise at targeted location (adhesive film) was observed, while the substrate/surrounding materials exhibited minimal temperature change. Overall, reversible adhesives such as the ones explored in this work show great promise in a wide range of multi-material joining applications.