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International Conference on Intelligent Manufacturing and Materials (ICIMM 2016)

  • International Conference on Intelligent Manufacturing and Materials (ICIMM 2016)
  • ISBN: 978-1-60595-363-2
  • ISSN: 

The International Conference on Intelligent Manufacturing and Materials (ICIMM 2016) creates an academic platform for international experts and researchers in relative fields to share and exchange the latest research results and problem solving solutions. ICIMM 2016 has collected advanced results and trends in the field of Electrical and Electronic Engineering, Manufacturing Process, Control Engineering, Materials, Computers and Information technology.

As a standard, DEStech will submit the technical science conference proceedings to be indexed in EI (Citation and Compendex). DEStech will submit the technical science conference proceedings to EI, Clarivate Analytics (formerly Thomson Reuters Web of Science) and CNKI Scholar for worldwide online citation within one month after the Proceedings is completed. Please note that DEStech does not submit Proceedings of Social Science to EI since they will not be accepted for EI Compendex. However, DEStech will submit proceedings of Social Science to Thomson Reuters Conference Proceedings Citation Index-Social Science & Humanities (CPCI-SSH). We also caution our editors that Proceedings containing plagiarized material and Proceedings advertised that they will definitely be accepted by EI will be rejected by EI.

2016 International Conference on Intelligent Manufacturing and Materials
DEStech Publications, Inc. 
439 North Duke Street 
Lancaster, Pennsylvania 17602 U.S.A. 
Copyright © 2016 by DEStech Publications, Inc. 
No part of this publication may be reproduced, stored in a retrieval system, or transmitted, in any form or by any means, electronic, mechanical, photocopying, recording, or otherwise, without the prior written permission of the publisher. 
Manufactured in the U.S.A. 
Main entry under title: 
2016 International Conference on Intelligent Manufacturing and Materials (ICIMM 2016)
ISBN: 978-1-60595-363-2
Permission for publication outside of this Conference Proceeding must be given by the Publisher.

Cover Page

5th International Conference on Materials Engineering for Advanced Technologies (ICMEAT 2016)

  • 5th International Conference on Materials Engineering for Advanced Technologies (ICMEAT 2016)
  • ISBN: 978-1-60595-373-1
  • ISSN: 

2016 5th International Conference on Materials Engineering for Advanced Technologies (ICMEAT 2016) will be held on August 5–6, 2016, Quebec City, Canada. ICMEAT 2016 is sponsored by American Applied Sciences Research Institute, USA and technical co-sponsored by DEStech Publications, USA. The proceedings of ICMEAT 2016 will be published by DEStech Publications, USA. 2015 4th International Conference on Materials Engineering for Advanced Technologies (ICMEAT 2015) has been held in London, England, June 27–28, 2015. All ICMEAT 2015 Proceedings papers have been indexed by CPCI-S. The proceeding of ICMEAT 2016 not only includes papers of ICMEAT 2016, also includes papers from ICCT 2016, MBSM 2016, and SMTA 2016. Three of the conferences, including 2016 3rd International Conference on Communication Technology (ICCT 2016), the 2nd International Conference on the Mechanics of Biological Systems and Materials (MBSM 2016), and 2016 2nd International Conference on Circuits and Systems (CAS 2016) will be held on August 5–6, 2016, Quebec City, Canada. The goal of ICMEAT 2016 is to bring together the researchers from academia and industry as well as practitioners to share ideas, problems and solutions relating to the multifaceted aspects of Materials Engineering for Advanced Technologies. 

As a standard, DEStech will submit the technical science conference proceedings to be indexed in EI (Citation and Compendex). DEStech will submit the technical science conference proceedings to EI, Clarivate Analytics (formerly Thomson Reuters Web of Science) and CNKI Scholar for worldwide online citation within one month after the Proceedings is completed. Please note that DEStech does not submit Proceedings of Social Science to EI since they will not be accepted for EI Compendex. However, DEStech will submit proceedings of Social Science to Thomson Reuters Conference Proceedings Citation Index-Social Science & Humanities (CPCI-SSH). We also caution our editors that Proceedings containing plagiarized material and Proceedings advertised that they will definitely be accepted by EI will be rejected by EI. 

2016 5th International Conference on Materials Engineering for Advanced Technologies
DEStech Publications, Inc. 
439 North Duke Street 
Lancaster, Pennsylvania 17602 U.S.A. 
Copyright © 2016 by DEStech Publications, Inc. 
No part of this publication may be reproduced, stored in a retrieval system, or transmitted, in any form or by any means, electronic, mechanical, photocopying, recording, or otherwise, without the prior written permission of the publisher. 
Manufactured in the U.S.A. 
Main entry under title: 
2016 5th International Conference on Materials Engineering for Advanced Technologies (ICMEAT 2016)
ISBN: 978-1-60595-373-1
Permission for publication outside of this Conference Proceeding must be given by the Publisher.


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