DEStech Transactions on Computer Science and Engineering


2nd International Conference on Computer Science and Technology (CST 2017)


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  • 2nd International Conference on Computer Science and Technology (CST 2017)
  • ISBN: 978-1-60595-461-5
  • ISSN: 2475-8841

The Second International Conference on Computer Science and Technology (CST 2017) has built on the success of the first CST 2016 event so as to provide an outstanding venue for the presentation of forefront research in various topics within computer science and technology. These include big data, system architecture, hardware and applications. The conference has been successfully held on May 26–28, 2017 in Guilin, China—a city known for its picturesque scenery and modern industrial investments. The event is co-organized by the Science and Engineering Research Center (Hong Kong) and the Faculty of Physics and Applied Computer Science, AGH University of Science and Technology (Poland).

As a standard, DEStech will submit the technical science conference proceedings to be indexed in EI (Citation and Compendex). DEStech will submit the technical science conference proceedings to EI, Clarivate Analytics (formerly Thomson Reuters Web of Science) and CNKI Scholar for worldwide online citation within one month after the Proceedings is completed. Please note that DEStech does not submit Proceedings of Social Science to EI since they will not be accepted for EI Compendex. However, DEStech will submit proceedings of Social Science to Thomson Reuters Conference Proceedings Citation Index-Social Science & Humanities (CPCI-SSH). We also caution our editors that Proceedings containing plagiarized material and Proceedings advertised that they will definitely be accepted by EI will be rejected by EI.

2017 2nd International Conference on Computer Science and Technology
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Main entry under title: 
2017 2nd International Conference on Computer Science and Technology (CST 2017)
ISBN: 978-1-60595-461-5
Permission for publication outside of this Conference Proceeding must be given by the Publisher.