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Designing Multifunctional Interfaces to Bridge Heterogeneous Materials to Reduce Thermal Fatigue

JOHN B. F FERGUSON, AJIT K. ROY, SABYASACHI GANGULI, JOHN G. JONES, SERGEI V. SHENOGIN, SANGWOOK SIHN, KRISHNAMURTHY MAHALINGAM

Abstract


Composite interfaces between heterogeneous materials exist in many applications which includes electronics packaging. The interface will affect properties such as mechanical integrity during thermal cycling, heat transport and electrical transport due to the inherent disparate properties such as coefficient of thermal expansion (CTE), atomic structure, interface bonding and fabrication processes. Novel interface engineering will be vital for electronics packaging utilized in extreme environment temperatures beyond the standard ranges such as -55 °C to 150 °C. The failure of standard electronics packaging materials with heterogeneous interfaces under thermal cycle fatigue is investigated. Based on the failure analysis, several multifunctional interfaces are developed to bridge the heterogeneous interface and to provide the desired properties and functionality. Approaches to achieve these heterogeneous structures, the materials choices to preserve the multifunctional properties and the modeling predictions are considered. Test structures are prepared of the candidate interfaces, the morphologies are investigated and testing of the thermal cycle fatigue properties over the range -55 °C to 300 °C is performed and will be discussed.


DOI
10.12783/asc36/35863

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References


Knoll, H., W. Weidenauer, P. Ingram, S. Bennemann, S. Brand, M. Petzold, 2010. “Ceramic

Substrates with Aluminum Metallization for Power Application,” Presented at 3rd Elect. Sys.-

Integration Tech. Conf., Sept. 13-16, 2010.

Scofield, J. D., J. N. Merrett, J. Richmond, A. Agarwal, S. Leslie. 2010. “Electrical and Thermal

Performance of 1200 V, 100 A, 200°C 4H-SiC MOSFET-based Power Switch Modules,” Materials

Science Forum, 645-8(2):1119-1122.

Miyazaki, H., Y. Zhou, S. Iwakiri, H. Hirotsuru, K. Hirao, S. Fukuda, N. Izu, H. Hyuga, 2018.

"Improved resistance to thermal fatigue of active metal brazing substrates for silicon carbide power

modules using tough silicon nitrides with high thermal conductivity," Ceramics Intl., 44: 8870-

McGinnis, A. J., T. R. Watkins, K. Jagannadham. 1999. "Residual stresses in a multilayer system of

coatings," Adv. X-ray Anal., 41: 443-454.

Turchanin, M. A., P. G. Agraval, T. Y.. Velikanova, A. A. Vodopyanova. 2018. “Predicting the

composition ranges of amorphization for multicomponent melts in the framework of the Calphad

method,” Powder Metallurgy and Metal Ceramics, 57(1-2): 57-70.

Zhang, S., W. Jin, H. Yang, K. Gao, X. Pang, L. Yan, A. A. Volinsky. 2018. "Comparative study of

Ti and Cr adhesion to the AlN ceramic: Experiments and calculations," Appl. Surf. Sci., 457: 856-

Gunnars, J., U. Wiklund. 2002. "Determination of growth-induced strain and thermo-elastic

properties of coatings by curvature measurements," Matls. Sci. Eng., A336: 7-21.

Shenogin, S., J. Ferguson, S. Ganguli, A. K. Roy. 2021. "Studying the applicability of amorphous

metal alloys as interface material for power electronics packaging," Materialia, 18: 101142.1-10.

Ren, L.W., M.M. Meng, Z. Wang, F.Q. Yang, H.J. Yang, T. Zhang, J.W. Qiao. 2015.

"Enhancement of plasticity in Zr-based bulk metallic glasses electroplated with copper coatings,"

Intermetallics, 57:121-126.

Tsai, M.Y., P.S. Huang, C.H. Lin, C.T. Wu, S.C. Hu. 2015. “Mechanical design and analysis of

direct-plated-copper aluminum nitride substrates for enhancing thermal reliability,”

Microelectronics Reliability, 55: 2589-2595.

Gunther, M., K.-J. Wolter, M. Rittner, W. Nuchter. 2006. "Failure Mechanisms of Direct Copper

Bonding Substrates (DCB)", 2006 IEEE 1st Electr. Sys. Integration Tech. Conf., 2: 714-718.

Xu, L., Y. Zhou, S. Liu. 2013. "DBC Substrates in Si- and SiC-based Power Electronics Modules:

Design, Fabrication and Failure Analysis", 2013 IEEE 63rd Electr. Comp. & Tech. Conf., 1341-


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