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Predicting Adhesive Bond Performance Based on Initial Dielectric Properties

PRIYANSHU KUMAR BANERJEE, MUTHU RAM PRABHU ELENCHEZHIAN, NINA SHUTE, VAMSEE VADLAMUDI, RASSEL RAIHAN, KENNETH REIFSNIDER

Abstract


In recent years, there has been a widespread growth in the application of composite materials particularly in the Aerospace and Automotive sectors. This is because composite structures are generally comparatively light in weight and provide corrosion and wear resistance as compared to metals or ceramics. Due to the strict failsafe philosophy of the aerospace industry, the certification approach for current practice in joining composite materials is to thicken the joining areas and to use numerous fasteners which in turn increases the weight and stress concentrations in the structure. The use of adhesive bonding can improve the stress distribution between the composite materials / dissimilar materials and can contribute to a lighter structure. However, there much investigation is yet to be done in this discipline to predict the bond strength and performance using non-destructive evaluation methods. This paper will focus on an approach to study the mechanical as well as the dielectric properties of an adhesive bond. The dielectric testing is done by using Broadband Dielectric Spectroscopy (BbDS), wherein the dielectric characteristics of the material are analyzed in a wide frequency spectrum. The data obtained by this technique are used to demonstrate the charge transport, the combined dipolar fluctuation, and the effects of polarization occurring between the boundaries of materials. The continuous modifications of the dielectric spectra are due to the changes in the electrical and structural interactions between the particles, shapes, and orientations of the constituent phases of the morphological structure of the material system. Information about the morphologies, impurities/contamination or interaction of the dissimilar surfaces of the pristine bond can be obtained from the initial BbDS properties. The dielectric properties for adhesively bonded composites with different surface adhesion properties have shown promising evidence of predicting the final mechanical performance of the bonded material system. The success and limitations of this approach will be discussed, and needs for continued investigation identified

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