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Thermal Evaluation of Epoxy Resin Using n-hexadecane Based Shape Stabilized PCM for Energy Saving in Building

SU-GWANG JEONG, SUMIN KIM

Abstract


Epoxy resin has excellent characteristics of moisture, low toughness, solvent and chemical resistance, low shrinkage on cure, superior electrical and mechanical resistance properties, and good adhesion to many substrates. In this experiment, we prepared epoxy resin with shape stabilized PCM, to enhance the thermal properties of epoxy resin. The SSPCM (shape stabilized PCM) was prepared through the vacuum impregnation method, and the SSPCM/epoxy resin composites were prepared through the shear stirring process and curing process. In the preparation process, the epoxy resin and hardener were mixed in a beaker at a one-to-one ratio. Then, 5wt%, 10wt%, 15wt% and 20wt% of the SSPCM was added to the mixture. The thermal properties of epoxy resin with SSPCM were analyzed from DSC, TGA and UTM analyzer. From the analysis, we determined that the prepared epoxy resin with SSPCM has heat storage capacity and high thermal conductivity, compared with the epoxy resin.

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